Mechanic Solder Paste Xgsp50

Mechanic XGSP50 is a high-performance, leaded (Sn63/Pb37) solder paste designed for electronics repair, particularly for BGA reballing and SMD rework. It features a 1 8 3 ∘ C melting point, 25-45 micron particle size, and high-quality flux, offering excellent wetting and strong, bright joints. It is commonly used in 35g-42g jars