Soldering Workstation Reflow

Enables the user to easily and efficiently perform desoldering, pad-cleaning, positioning and soldering Full rework cycle capability meets highest repeatability and reproducibility of results No optical calibration needed Applicable Use: 1. For desoldering various elements, such as: SOIC CHIP QFP PLCC BGA etc. 2. Except for the heat-shrinkable paint drying adhesive removal thawed Preheat plastic welding